T.C. Chai

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · IEEE Transactions on Advanced Packaging · 2009 · 290 citations

Engineering, Most Tsvs, Thermal Expansion +26

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 119 citations

Engineering, Radio Frequency, Integrated Circuits +18

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · 2008 · 93 citations

Development of 3D silicon module with TSV for system in packaging

Navas Khan, Vempati Srinivasa Rao, Samule Lim et al. · 2008 · 78 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +13