T.C. Chai - Concepedia

Author

T.C. Chai

Also Known As

T C Chai, T. C. Chai, T. Chai, T.C. Chai, TaiYuan Chai, Taiyuan Chai, Tianqi Chai, Tianxing Chai, Tong-Yuen Chai, Tshun Chuan Chai

Publications

1.1K

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics Agency for Science, Technology and Research Singapore Science Park National University of Singapore Singapore Institute of Manufacturing Technology

About

T.C. Chai is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	16	885
2	Electrical Engineering	11	11	804
3	Applied Physics	7	7	527
4	Computer Engineering	6	6	376
5	Chemical Engineering	1	1	23

T.C. Chai

Publications

988

Citations

H-Index

Page 1

	Year	Citations
Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang, IEEE Transactions on Advanced Packaging EngineeringMost TsvsThermal ExpansionThermal ConductivityFlip-chip Microbumps	2009	290
Development of 3-D Silicon Module With TSV for System in Packaging Navas Khan, V. S. Rao, Sharon Pei-Siang Lim, IEEE Transactions on Components and Packaging Technologies EngineeringRadio FrequencyIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2010	119
Development of through silicon via (TSV) interposer technology for large die (21&#x00D7;21mm) fine-pitch Cu/low-k FCBGA package Xiaowu Zhang, T.C. Chai, John H. Lau, EngineeringComputer ArchitectureLarge DieInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2009	109
Nonlinear thermal stress/strain analyses of copper filled TSV (through silicon via) and their flip-chip microbumps Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang,	2008	93
Development of 3D silicon module with TSV for system in packaging Navas Khan, Vempati Srinivasa Rao, Samule Lim, Advanced Packaging3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineering	2008	78
Electromigration performance of Through Silicon Via (TSV) – A modeling approach Yung Chuen Tan, Cher Ming Tan, Xiaowu Zhang, Microelectronics Reliability Device ModelingElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)	2010	72
Board level drop test reliability of IC packages T.C. Chai, Ser Tong Quek, Wai Yin Hnin, EngineeringBoard DesignImpact LoadingMechanical EngineeringCommon Ic Packages	2005	41
Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests Y.C. Ong, V.P.W. Shim, T.C. Chai, EngineeringImpact (Mechanics)Structural CrashworthinessImpact LoadingMechanical Engineering	2004	37
Surface treatment of copper for the adhesion improvement to epoxy mold compounds C.Q. Cui, Huay Ling Tay, T.C. Chai, EngineeringMechanical EngineeringMolding (Process)Surface ProcessingChemical Engineering	2002	23
Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition Wenhui Zhu, Edith S. W. Poh, X. R. Zhang, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringSuperalloyCorrosion	2011	22

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