Navas Khan - Concepedia

Author

Navas Khan

Institute of Microelectronics ORCID

Also Known As

N. Khan, Navas Khan, Nazmul Hossain Khan

Publications

845

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics Agency for Science, Technology and Research Nanyang Technological University Institute of High Performance Computing Singapore Science Park

About

Navas Khan is an author at Institute of Microelectronics specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	15	18	662
2	Electrical Engineering	13	14	555
3	Computer Engineering	12	13	537
4	Applied Physics	2	2	43
5	Biomedical Engineering	1	1	16

Navas Khan

Publications

704

Citations

H-Index

Page 1

	Year	Citations
Development of 3-D Silicon Module With TSV for System in Packaging Navas Khan, V. S. Rao, Sharon Pei-Siang Lim, IEEE Transactions on Components and Packaging Technologies EngineeringRadio FrequencyIntegrated CircuitsInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2010	119
Development of 3D silicon module with TSV for system in packaging Navas Khan, Vempati Srinivasa Rao, Samule Lim, Advanced Packaging3D Ic ArchitectureElectrical EngineeringChip-scale PackageEngineering	2008	78
Three-dimensional system-in-package using stacked silicon platform technology V. Kripesh, Seung Wook Yoon, V.P. Ganesh, IEEE Transactions on Advanced Packaging EngineeringComputer ArchitectureGood DiceDaisy ChainAdvanced Packaging (Semiconductors)	2005	76
3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections Navas Khan, Li Yu, Tan Siow Pin, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringChip CarrierLiquid Metal Cooling3-D PackageFluidic Interconnections	2013	59
Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules Gong Yue Tang, S. P. Tan, Navas Khan, IEEE Transactions on Components and Packaging Technologies 3D Ic ArchitectureEngineeringFluid PropertiesLiquid Metal CoolingMechanical Engineering	2010	58
Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages Aibin Yu, Navas Khan, Giridhar Archit, IEEE Transactions on Components and Packaging Technologies EngineeringLiquid Metal CoolingSi ChipWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2009	43
Design and development of a multi-die embedded micro wafer level package V. Kripesh, Vempati Srinivas Rao, Aditya Kumar,	2008	42
Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules S. P. Tan, K.C. Toh, Navas Khan, IEEE Transactions on Components Packaging and Manufacturing Technology Product MiniaturizationEngineeringLiquid Metal Cooling3-D Silicon ModulesIntegrated Circuits	2011	27
Design and fabrication of a reliability test chip for 3D-TSV A. D. Trigg, Li Yu, Xiaowu Zhang, Reliability Test ChipEngineeringReliability EngineeringAdvanced Packaging (Semiconductors)Chip Stacks	2010	27
Development of 3-D Stack Package Using Silicon Interposer for High-Power Application Navas Khan, Seung Wook Yoon, A.G.K. Viswanath, IEEE Transactions on Advanced Packaging EngineeringComputer ArchitectureAdvanced Packaging (Semiconductors)Electronic Packaging3D Ic Architecture	2008	24

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