Concepedia

Navas Khan

NK

19

Publications

704

Citations

15

H-Index

2005

Active since

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Nanyang Technological University

Institute of High Performance Computing

Singapore Science Park

Navas Khan is an author at Institute of Microelectronics specializing in engineering, microelectronics, and electronic packaging.

Top concepts

EngineeringMicroelectronicsElectronic PackagingElectrical EngineeringMicrofabricationComputer Engineering3D PrintingHeat TransferThermal EngineeringAdvanced Packaging

Publications per year

2005–2020

19

Publications

19

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 119 citations

Engineering, Radio Frequency, Integrated Circuits +18

Development of 3D silicon module with TSV for system in packaging

Navas Khan, Vempati Srinivasa Rao, Samule Lim et al. · 2008 · 78 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +13

Three-dimensional system-in-package using stacked silicon platform technology

V. Kripesh, Seung Wook Yoon, V.P. Ganesh et al. · IEEE Transactions on Advanced Packaging · 2005 · 76 citations

Engineering, Computer Architecture, Good Dice +16

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

Navas Khan, Li Yu, Tan Siow Pin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 59 citations

Engineering, Chip Carrier, Liquid Metal Cooling +21

Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Gong Yue Tang, S. P. Tan, Navas Khan et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 58 citations

3D Ic Architecture, Engineering, Fluid Properties +12

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