Concepedia

V. Kripesh

VK

60

Publications

2K

Citations

26

H-Index

2000

Active since

Affiliations

Institute of Microelectronics(Current)

Agency for Science, Technology and Research

Singapore Science Park

National University of Singapore

Nanyang Technological University

V. Kripesh is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMicroelectronicsMicrofabricationMaterial ScienceApplied Physics3D PrintingAdvanced PackagingIntegrated Circuits

Publications per year

2000–2013

60

Publications

60

Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

Mohan Kumar Kesarla, V. Kripesh, A.A.O. Tay · Journal of Alloys and Compounds · 2006 · 166 citations

Materials Science, Engineering, Carbon-based Material +6

High RF performance TSV silicon carrier for high frequency application

Soon Wee Ho, Seung Wook Yoon, Qiaoer Zhou et al. · 2008 · 131 citations

Engineering, Radio Frequency, High Frequency Signal +17

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 119 citations

Engineering, Radio Frequency, Integrated Circuits +18

Development of through silicon via (TSV) interposer technology for large die (21&#x00D7;21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect

Jae-Woong Nah, Jong-ook Suh, K. N. Tu et al. · Journal of Applied Physics · 2006 · 99 citations · Full text

Advanced Packaging, Materials Science, Electrical Engineering +14

Rows per page

1–5 of 60