Sharon Pei-Siang Lim

Development of 3-D Silicon Module With TSV for System in Packaging

Navas Khan, V. S. Rao, Sharon Pei-Siang Lim et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 119 citations

Engineering, Radio Frequency, Integrated Circuits +18

Process Development and Reliability of Microbumps

Sharon Pei-Siang Lim, Vempati Srinivasa Rao, Wai Yin Hnin et al. · IEEE Transactions on Components and Packaging Technologies · 2010 · 28 citations

Engineering, Mechanical Engineering, Assembly Process Development +17

An investigation on the plasma treatment of integrated circuit bond pads

Y. F. Chong, R. Gopalakrishnan, C.F. Tsang et al. · Microelectronics Reliability · 2000 · 25 citations

Electrical Engineering, Engineering, Nonthermal Plasma +7

Influence of Bump Geometry, Adhesives and Pad Finishings on the Joint Resistance of Au Bump and A/NCA Flip Chip Interconnection

Tan Min, Sharon Pei-Siang Lim, Anders Yeo et al. · 2006 · 16 citations

Engineering, Mechanical Engineering, Advanced Packaging (Semiconductors) +17

Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device

Chee Houe Khong, Xiaowu Zhang, Navas Khan et al. · 2010 · 16 citations

Offset Distance, Engineering, Mechanical Engineering +25