Chee Houe Khong

A novel method to predict die shift during compression molding in embedded wafer level package

Chee Houe Khong, Aditya Kumar, Xiaowu Zhang et al. · 2009 · 52 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +13

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

Srinivasa Rao Vempati, Nandar Su, Chee Houe Khong et al. · 2009 · 42 citations

Engineering, Biomedical Engineering, Microelectromechanical Systems +14

Application of piezoresistive stress sensors in ultra thin device handling and characterization

Xiaowu Zhang, Aditya Kumar, Q.X. Zhang et al. · Sensors and Actuators A Physical · 2009 · 34 citations

Engineering, Materials Engineering, Materials Science +14

3D interconnection process development and integration with low stress TSV

Tze‐Kwang Chua, Soon Wee Ho, H. Y. Li et al. · 2010 · 19 citations

Engineering, Manufacturing Engineering, Materials Science +16

Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device

Chee Houe Khong, Xiaowu Zhang, Navas Khan et al. · 2010 · 16 citations

Engineering, Biomedical Engineering, Electrical Engineering +17