Tze‐Kwang Chua - Concepedia

Author

Tze‐Kwang Chua

Agency for Science, Technology and Research

Also Known As

Chua, Tze-Kwang, T. T. Chua, Tze-Kwang Chua, Tze‐Kwang Chua

Publications

266

Citations

H-Index

Concepts

All Affiliations

Agency for Science, Technology and Research Singapore Immunology Network National University of Singapore University of Liverpool Nanyang Technological University

About

Tze‐Kwang Chua is an author at Agency for Science, Technology and Research specializing in 3d integration, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	2	2	42
2	Computer Engineering	2	2	42
3	Materials Engineering	2	2	42
4	Applied Physics	1	1	23
5	Materials Science	1	1	19

Tze‐Kwang Chua

Publications

250

Citations

H-Index

Page 1

	Year	Citations
Longitudinal Study of Cellular and Systemic Cytokine Signatures to Define the Dynamics of a Balanced Immune Environment During Disease Manifestation in Zika Virus–Infected Patients Fok‐Moon Lum, David Chien Lye, Jeslin J. L. Tan, The Journal of Infectious Diseases	2018	52
<i>Viperin</i> controls chikungunya virus–specific pathogenic T cell IFNγ Th1 stimulation in mice Guillaume Carissimo, Teck‐Hui Teo, Yi‐Hao Chan, Life Science Alliance	2019	37
Zika Virus Infection Preferentially Counterbalances Human Peripheral Monocyte and/or NK Cell Activity Fok‐Moon Lum, David Lee, Tze‐Kwang Chua, mSphere	2018	36
Plasmodium co-infection protects against chikungunya virus-induced pathologies Teck‐Hui Teo, Fok‐Moon Lum, Khairunnisa Abdul Ghaffar, Nature Communications	2018	31
VCP/p97 Is a Proviral Host Factor for Replication of Chikungunya Virus and Other Alphaviruses Guillaume Carissimo, Yi‐Hao Chan, Age Utt, Frontiers in Microbiology	2019	28
Immunological observations and transcriptomic analysis of trimester‐specific full‐term placentas from three Zika virus‐infected women Fok‐Moon Lum, Vipin Narang, Susan Swee‐Shan Hue, Clinical & Translational Immunology	2019	24
Characterization and management of wafer stress for various pattern densities in 3D integration technology X. F. Pang, Tze‐Kwang Chua, H. Y. Li, Wafer Warpage ReductionEngineeringWafer StressResidual StressIntegration Technology	2010	23
3D interconnection process development and integration with low stress TSV Tze‐Kwang Chua, Soon Wee Ho, H. Y. Li, EngineeringDevice IntegrationMechanical EngineeringD Interconnect TechnologyComputer-aided Design	2010	19

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