Srinivasa Rao Vempati

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

A novel method to predict die shift during compression molding in embedded wafer level package

Chee Houe Khong, Aditya Kumar, Xiaowu Zhang et al. · 2009 · 52 citations

Engineering, Mechanical Engineering, Molding (Process) +19

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

Srinivasa Rao Vempati, Nandar Su, Chee Houe Khong et al. · 2009 · 42 citations

3-D Silicon Die, Flip Chip Technology, Engineering +17

Soret and Dufour effects on unsteady MHD flow past an infinite vertical porous plate with thermal radiation

Srinivasa Rao Vempati, A. B. Laxmi-Narayana-Gari · Applied Mathematics and Mechanics · 2010 · 35 citations

Engineering, Physics, Mixed Convection +12

Influence of slip condition on transient laminar flow over an infinite vertical plate with ramped temperature in the presence of chemical reaction and thermal radiation

Y. Dharmendar Reddy, M. Anil Kumar, Srinivasa Rao Vempati et al. · Heat Transfer · 2021 · 34 citations

Radiative Heat Transfer, Engineering, Fluid Mechanics +16