High RF performance TSV silicon carrier for high frequency application

Soon Wee Ho, Seung Wook Yoon, Qiaoer Zhou, +3

EngineeringRadio FrequencyHigh Frequency SignalHigh FrequencyInterconnect (Integrated Circuits) +15

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho, +13

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +18

Microfabrication and Characterization of W-Band Planar Helix Slow-Wave Structure With Straight-Edge Connections

Ciersiang Chua, Julius M. Tsai, Sheel Aditya, +4

IEEE Transactions on Electron Devices

Straight-edge ConnectionsPlanar HelixPhysicsMicrofabricationSlow-wave Structure +11

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

Navas Khan, Li Yu, Tan Siow Pin, +5

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringChip CarrierLiquid Metal Cooling3-D PackageFluidic Interconnections +19

Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

Gaurav Sharma, Aditya Kumar, Vempati Srinivas Rao, +2

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringMechanical EngineeringMolding (Process)Wafer Scale ProcessingAdvanced Packaging (Semiconductors) +15

Study of 15µm pitch solder microbumps for 3D IC integration

Aibin Yu, John H. Lau, Soon Wee Ho, +7

EngineeringUltra Fine PitchIntegrated CircuitsWafer Scale ProcessingAdvanced Packaging (Semiconductors) +16

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

Aibin Yu, John H. Lau, Soon Wee Ho, +11

EngineeringSi ChipIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale Processing +16

Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration

Rui Li, Jin Cheng, Siong Chiew Ong, +3

IEEE Transactions on Components Packaging and Manufacturing Technology

EngineeringEmwlp ModuleElectromagnetic CompatibilityFrequency BandAdvanced Packaging (Semiconductors) +14

77-GHz Automotive Radar Sensor System With Antenna Integrated Package

Ka Fai Chang, Rui Li, Jin Cheng, +4

IEEE Transactions on Components Packaging and Manufacturing Technology

Transceiver Bare DieEngineeringElectromagnetic CompatibilityLevel PackagingAdvanced Packaging (Semiconductors) +15

Development of coaxial shield via in silicon carrier for high frequency application

Soon Wee Ho, Vempati Srinivas Rao, Oratti Navas Khan, +2

EngineeringMicrowave TransmissionIntegrated CircuitsHigh FrequencySilicon On Insulator +16