Soon Wee Ho

High RF performance TSV silicon carrier for high frequency application

Soon Wee Ho, Seung Wook Yoon, Qiaoer Zhou et al. · 2008 · 131 citations

Engineering, Radio Frequency, High Frequency Signal +17

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Microfabrication and Characterization of W-Band Planar Helix Slow-Wave Structure With Straight-Edge Connections

Ciersiang Chua, Julius M. Tsai, Sheel Aditya et al. · IEEE Transactions on Electron Devices · 2011 · 62 citations

Straight-edge Connections, Planar Helix, Physics +13

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

Navas Khan, Li Yu, Tan Siow Pin et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 59 citations

Engineering, Chip Carrier, Liquid Metal Cooling +21

Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

Gaurav Sharma, Aditya Kumar, Vempati Srinivas Rao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 59 citations

Engineering, Mechanical Engineering, Molding (Process) +17