Vempati Srinivas Rao

Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding

Gaurav Sharma, Aditya Kumar, Vempati Srinivas Rao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 59 citations

Engineering, Mechanical Engineering, Molding (Process) +17

Wafer level embedding technology for 3D wafer level embedded package

Aditya Kumar, Xia Dingwei, Vasarla Nagendra Sekhar et al. · 2009 · 49 citations

Engineering, Mechanical Engineering, Computer Architecture +18

Design and development of a multi-die embedded micro wafer level package

V. Kripesh, Vempati Srinivas Rao, Aditya Kumar et al. · 2008 · 42 citations

Embedded wafer level packages with laterally placed and vertically stacked thin dies

Gaurav Sharma, Vempati Srinivas Rao, Aditya Kumar et al. · 2009 · 34 citations

Engineering, Mechanical Engineering, Interconnect (Integrated Circuits) +18

Development of coaxial shield via in silicon carrier for high frequency application

Soon Wee Ho, Vempati Srinivas Rao, Oratti Navas Khan et al. · 2006 · 30 citations

Engineering, Microwave Transmission, Integrated Circuits +18