Statistics
Publications
457
Citations
13.2K
Authors
171
Location
Taichung, Taiwan
457
Chun-Nien Chen, Yi-Hsien Lin, Li-Cheng Hung et al. · IEEE Transactions on Microwave Theory and Techniques · 2020 · 98 citations
Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations
Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20
Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit Analysis
Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin et al. · Micromachines · 2023 · 64 citations · Full text
Warpage characterization of panel Fan-out (P-FO) package
Hung‐wen Liu, Yiwei Liu, Jason Ji et al. · 2014 · 62 citations
Materials Science, Advanced Packaging, Electrical Engineering +15
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