Don Son Jiang - Concepedia

Author

Don Son Jiang

Siliconware Precision Industries (Taiwan)

Also Known As

D. S. Jiang, D.S. Jiang, Don Son Jiang

Publications

448

Citations

H-Index

Concepts

All Affiliations

Siliconware Precision Industries (Taiwan)National Cheng Kung University

About

Don Son Jiang is an author at Siliconware Precision Industries (Taiwan) specializing in engineering, mechanics of materials, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	7	7	289
2	Materials Engineering	2	2	155
3	Applied Physics	1	1	12
4	Chemistry	1	1	143
5	Electrical Engineering	1	1	14

Don Son Jiang

Publications

350

Citations

H-Index

Page 1

	Year	Citations
Effects of limited cu supply on soldering reactions between SnAgCu and Ni Cheng–En Ho, You-Cian Lin, Shenghao Yang, Journal of Electronic Materials Materials EngineeringMaterials ScienceEngineeringCorrosionMetallurgical Process	2006	143
Effects of underfill materials on the reliability of low-K flip-chip packaging K.M. Chen, Don Son Jiang, Nicholas Kao, Microelectronics Reliability Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2005	54
Silver alloy wire bonding Liao Kai, Liang Yi Hung, L. Wu,	2012	50
Crack propagation behavior of A356 aluminum alloy under resonant vibration Don Son Jiang, T. S. Lui, L.H. Chen Scripta Materialia Stress WaveEngineeringMechanical BehaviorMechanicsMechanical Engineering	1997	29
The fracture behaviour of A356 alloys with different iron contents under resonant vibration Jeng‐Haur Horng, Don Son Jiang, T. S. Lui, International Journal of Cast Metals Research EngineeringResonant VibrationMechanical EngineeringHigh Strength Low Alloy SteelIron Content	2000	21
Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests Yi‐Cheng Chu, Chih Chen, Nicholas Kao, Electronic Materials Letters Materials ScienceEngineeringMechanical PropertiesMechanical BehaviorMechanical Engineering	2017	16
Stress simulation and design optimal study for Cu pillar bump structure Vito Lin, Nicholas Kao, Don Son Jiang, EngineeringMechanical EngineeringResidual StressStructural OptimizationSolder Bump	2013	14
Crack Propagation Behavior of A356 and Al&ndash;1Si&ndash;0.3Mg Aluminum Alloys under Resonant Vibration Don Son Jiang, T. S. Lui, L. H. Chen Materials Transactions JIM A356 Aluminum AlloyEngineeringSevere Plastic DeformationResonant VibrationMechanical Engineering	1999	12
Comparison of 3D Packages with $20 \mu \mathrm{m}$ bump pitch using reflow soldering and thermal compression bonding Mu Hsuan Chan, Chris Chuang, Yu Lung Huang,	2021	11

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