Effects of underfill materials on the reliability of low-K flip-chip packaging - Concepedia

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Effects of underfill materials on the reliability of low-K flip-chip packaging

54

Citations

7

References

2005

Year

K.M. Chen, Don Son Jiang, Nicholas Kao, J.Y. Lai

Microelectronics Reliability

Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On BoardLow-k Flip-chip PackagingChip AttachmentElectronic PackagingMicroelectronicsUnderfill MaterialsMechanics Of Materials

References

	Year	Citations

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