J.Y. Lai

Effects of underfill materials on the reliability of low-K flip-chip packaging

K.M. Chen, Don Son Jiang, Nicholas Kao et al. · Microelectronics Reliability · 2005 · 55 citations

Engineering, Materials Engineering, Materials Science +13

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Woon‐Seong Kwon, Myongseob Kim, Jonathan Chang et al. · IMAPSource Proceedings · 2013 · 26 citations

Engineering, Electrical Engineering, Manufacturing Engineering +17

Development of Non-TSV Interposer (NTI) for High Electrical Performance Package

Fang-Yu Liang, Hung-Hsien Chang, Wen-Tsung Tseng et al. · 2016 · 17 citations

Engineering, Electrical Engineering, Materials Science +17

Bridging the gap: package level and system level thermal modeling

W. Wang, Sz‐Chian Liou, Yuhao Sun et al. · 2002 · 12 citations

Engineering, Systems Engineering, Heat Transfer +16

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC

K.M. Chen, Bian Wu, Kai Tang et al. · Microelectronics Reliability · 2005 · 11 citations

Natural Sciences, Materials Science, Mechanical Behavior Of Materials +6