Nicholas Kao

Warpage characterization of panel Fan-out (P-FO) package

Hung‐wen Liu, Yiwei Liu, Jason Ji et al. · 2014 · 62 citations

Materials Science, Advanced Packaging, Electrical Engineering +15

Effects of underfill materials on the reliability of low-K flip-chip packaging

K.M. Chen, Don Son Jiang, Nicholas Kao et al. · Microelectronics Reliability · 2005 · 54 citations

Materials Science, Chip-scale Package, Engineering +8

Warpage and Stress Characteristic Analyses on Package-on-Package (PoP) Structure

Yuan Lin Tzeng, Nicholas Kao, Eason Chen et al. · 2007 · 23 citations

Sip Family, Engineering, Stress Characteristic Analyses +17

Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

Jay Lia, F. J. Tsai, Jackson Li et al. · 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) · 2021 · 20 citations

Engineering, Computer Architecture, Chip Module +16

Underfill Assessments and Validations for Low-k FCBGA

Nicholas Kao, Jeng Yuan Lai, Jase Jiang et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 2006 · 17 citations

Engineering, Measurement, Education +22