Nicholas Kao - Concepedia

Author

Nicholas Kao

Siliconware Precision Industries (Taiwan)

Also Known As

Joerg Franke, N. Kao, N.H. Kao, Nicholas Kao

Publications

394

Citations

H-Index

Concepts

All Affiliations

Siliconware Precision Industries (Taiwan)United Microelectronics (Taiwan)

About

Nicholas Kao is an author at Siliconware Precision Industries (Taiwan) specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	12	272
2	Computer Engineering	4	4	74
3	Education	2	2	28
4	Applied Physics	2	2	32
5	Biostatistics	2	2	28

Nicholas Kao

Publications

286

Citations

H-Index

Page 1

	Year	Citations
Warpage characterization of panel Fan-out (P-FO) package Hung‐wen Liu, Yiwei Liu, Jason Ji, Materials ScienceAdvanced PackagingElectrical EngineeringChip-scale PackageEngineering	2014	62
Effects of underfill materials on the reliability of low-K flip-chip packaging K.M. Chen, Don Son Jiang, Nicholas Kao, Microelectronics Reliability Materials ScienceChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Chip On Board	2005	54
Warpage and Stress Characteristic Analyses on Package-on-Package (PoP) Structure Yuan Lin Tzeng, Nicholas Kao, Eason Chen, Sip FamilyEngineeringStress Characteristic AnalysesMechanical EngineeringStacking Assembly	2007	23
Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration Jay Lia, F. J. Tsai, Jackson Li, 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) EngineeringComputer ArchitectureChip ModuleAdvanced Packaging (Semiconductors)Heterogeneous Integration	2021	20
Underfill Assessments and Validations for Low-k FCBGA Nicholas Kao, Jeng Yuan Lai, Jase Jiang, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology EngineeringMeasurementEducationVerification And ValidationInterconnect (Integrated Circuits)	2006	17
Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests Yi‐Cheng Chu, Chih Chen, Nicholas Kao, Electronic Materials Letters Materials ScienceEngineeringMechanical PropertiesMechanical BehaviorMechanical Engineering	2017	16
Alternative 3D Small form Factor Methodology of System in Package for IoT and Wearable Devices Application Mike Tsai, Albert Lan, Chi Liang Shih, EngineeringWearable TechnologyIntegrated CircuitsFlip ChipAdvanced Packaging (Semiconductors)	2017	16
3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer Nistec Chang, C. Key Chung, Yu-Po Wang, EngineeringSignal LatencyInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2020	15
Stress simulation and design optimal study for Cu pillar bump structure Vito Lin, Nicholas Kao, Don Son Jiang, EngineeringMechanical EngineeringResidual StressStructural OptimizationSolder Bump	2013	14
Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics Jay Li, Terry Hsu, Ming-Han Zhuan,	2023	14

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