Jeng Yuan Lai

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Active since

2006

Affiliations

Siliconware Precision Industries (Taiwan)(Current)

Jeng Yuan Lai is an author at Siliconware Precision Industries (Taiwan) specializing in packaging engineering, package reliability, and packaging design.

Publications per year

2006–2008

Publications

Warpage and Stress Characteristic Analyses on Package-on-Package (PoP) Structure

Yuan Lin Tzeng, Nicholas Kao, Eason Chen et al. · 2007 · 23 citations

Engineering, Computer Engineering, Hardware-software Co-design +14

Underfill Assessments and Validations for Low-k FCBGA

Nicholas Kao, Jeng Yuan Lai, Jase Jiang et al. · Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology · 2006 · 17 citations

Engineering, Electrical Engineering, Materials Engineering +17

WLCSP parameter study for ball reliability analysis

Yuan Lin Tzeng, Eason Chen, Jeng Yuan Lai et al. · 2008 · 10 citations

Natural Sciences, Materials Engineering, Materials Science +14

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