2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

High Reliability Solution of 2.5D Package Technologies

Hsin Jou Lin, Vito Lin, Joe Lin et al. · 2021 · 21 citations

Engineering, Computer Engineering, High-performance Computing +17

Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

Jay Lia, F. J. Tsai, Jackson Li et al. · 2021 · 21 citations

Engineering, Computer Engineering, Electronic Materials +15

Cu CMP Dishing in High Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding

Hongmiao Ji, King-Jien Chui · 2021 · 15 citations

Engineering, Materials Engineering, Materials Science +13

Towards Heterogeneous Integrated Electronic-Photonic Packages for Hyperscale Data Centers

Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna et al. · 2021 · 13 citations

Engineering, Electrical Engineering, High-performance Computing +17

Fan-Out Embedded Bridge Solution in HPC Application

Shuai-Lin Bradley Liu, Nicholas Kao, Teny Shih et al. · 2021 · 10 citations

Engineering, Computer Engineering, Electrical Engineering +17