Ming Chinq Jong

Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor

Aditya Kumar, Xiaowu Zhang, Qing Xin Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 26 citations

Device Wafers, Engineering, Residual Stress Analysis +20

A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei et al. · 2023 · 20 citations

Optical Materials, Engineering, Device Integration +23

A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications

Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 17 citations

Engineering, Device Integration, Integrated Photonics +22

Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer

Yue Ying Ong, Tai Chong Chai, Daquan Yu et al. · 2009 · 14 citations

Engineering, Reliability Assessment, Micro-bumped Chips +16

Wafer Level Warpage Modelling and Validation for FOWLP Considering Effects of Viscoelastic Material Properties Under Process Loadings

Zhaohui Chen, Xiaowu Zhang, Sharon Pei Siang Lim et al. · 2019 · 14 citations

Warpage Correction, Engineering, Mechanical Engineering +21