Ming Chinq Jong

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Electrical Engineering, Materials Science +17

Study of 15µm pitch solder microbumps for 3D IC integration

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 57 citations

Engineering, Electrical Engineering, Materials Engineering +15

Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor

Aditya Kumar, Xiaowu Zhang, Qing Xin Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 27 citations

Engineering, Materials Engineering, Materials Science +16

A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres

Sajay Bhuvanendran Nair Gourikutty, Lau Boon Long, Seit Wen Wei et al. · 2023 · 23 citations

Engineering, Computer Engineering, Electrical Engineering +17

A Novel Packaging Platform for High-Performance Optical Engines in Hyperscale Data Center Applications

Sajay Bhuvanendran Nair Gourikutty, Ming Chinq Jong, Chockanathan Vinoth Kanna et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 17 citations

Engineering, Computer Engineering, Electrical Engineering +17