Aibin Yu

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Study of 15µm pitch solder microbumps for 3D IC integration

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 57 citations

Engineering, Ultra Fine Pitch, Integrated Circuits +18

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan et al. · Journal of Electronic Materials · 2008 · 54 citations

Materials Engineering, Materials Science, Thermal Insulation +14

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 51 citations

Engineering, Si Chip, Integrated Circuits +18

Si nanophotonics based cantilever sensor

Chengkuo Lee, Jayaraj Thillaigovindan, Chii‐Chang Chen et al. · Applied Physics Letters · 2008 · 46 citations

Photonic Sensor, Engineering, Biomedical Engineering +18