Aibin Yu

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Electrical Engineering, Materials Science +17

Study of 15µm pitch solder microbumps for 3D IC integration

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 57 citations

Engineering, Electrical Engineering, Materials Engineering +15

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan et al. · Journal of Electronic Materials · 2008 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +15

Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps

Aibin Yu, John H. Lau, Soon Wee Ho et al. · 2009 · 51 citations

Engineering, Electrical Engineering, Materials Science +17

Si nanophotonics based cantilever sensor

Chengkuo Lee, Jayaraj Thillaigovindan, Chii‐Chang Chen et al. · Applied Physics Letters · 2008 · 47 citations

Engineering, Bioengineering, Materials Science +17