Concepedia

Li Ling Yan

LL

Statistics

Publications

4

Citations

136

H-Index

4

Active since

2008

Affiliations

Agency for Science, Technology and Research(Current)

National University of Singapore

Institute of Microelectronics

Singapore Science Park

Li Ling Yan is an author at Agency for Science, Technology and Research specializing in materials engineering, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMaterials EngineeringApplied PhysicsSurface ScienceMicrostructureMechanical EngineeringCorrosionHeat Transfer

Publications per year

2008–2009

4

Publications

4

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan et al. · Journal of Electronic Materials · 2008 · 54 citations

Materials Engineering, Materials Science, Thermal Insulation +14

The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization

Daquan Yu, Chengkuo Lee, Li Ling Yan et al. · Applied Physics Letters · 2009 · 33 citations

Aluminium Nitride, Engineering, Hmp Component +18

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

Daquan Yu, Chengkuo Lee, Li Ling Yan et al. · Journal of Alloys and Compounds · 2009 · 30 citations

Materials Engineering, Materials Science, Cu/ni/au Metallization +11

Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization

Daquan Yu, Li Ling Yan, Chengkuo Lee et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 19 citations

Engineering, Cu/ti/au Metallization, Mechanical Engineering +17

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