Li Ling Yan - Concepedia

Author

Li Ling Yan

Also Known As

Li Ling Yan

Publications

149

Citations

H-Index

Concepts

All Affiliations

Li Ling Yan is an author at Agency for Science, Technology and Research specializing in materials engineering, engineering, and materials science.

#	Concept	H-Index	Publications	Citations
1	Engineering	4	4	136
2	Materials Engineering	4	4	136
3	Materials Science	4	4	136
4	Applied Physics	3	3	82
5	Electrical Engineering	1	1	33

Li Ling Yan

Publications

136

Citations

H-Index

Page 1

	Year	Citations
Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications Riko I Made, Chee Lip Gan, Li Ling Yan, Journal of Electronic Materials Materials EngineeringMaterials ScienceThermal InsulationEngineeringPackaging Applications	2008	54
The role of Ni buffer layer on high yield low temperature hermetic wafer bonding using In/Sn/Cu metallization Daquan Yu, Chengkuo Lee, Li Ling Yan, Applied Physics Letters Aluminium NitrideEngineeringHmp ComponentInterconnect (Integrated Circuits)Wafer Scale Processing	2009	33
Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization Daquan Yu, Chengkuo Lee, Li Ling Yan, Journal of Alloys and Compounds Materials EngineeringMaterials ScienceCu/ni/au MetallizationReliability StudyEngineering	2009	30
Wafer-Level Hermetic Bonding Using Sn/In and Cu/Ti/Au Metallization Daquan Yu, Li Ling Yan, Chengkuo Lee, IEEE Transactions on Components and Packaging Technologies EngineeringCu/ti/au MetallizationMechanical EngineeringWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2009	19

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