Publication | Closed Access

Characterization and reliability study of low temperature hermetic wafer level bonding using In/Sn interlayer and Cu/Ni/Au metallization

Materials EngineeringMaterials ScienceCu/ni/au MetallizationReliability StudyEngineeringWafer Scale ProcessingIn/sn InterlayerSurface ScienceApplied PhysicsMetallurgical InteractionChip AttachmentElectronic PackagingInterconnect (Integrated Circuits)Cladding (Metalworking)