Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications - Concepedia

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Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

54

Citations

8

References

2008

Year

Riko I Made, Chee Lip Gan, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau, Chengkuo Lee

Journal of Electronic Materials

Materials EngineeringMaterials ScienceThermal InsulationEngineeringPackaging ApplicationsMechanical EngineeringThermal PropertyChip AttachmentThermal AnalysisThermodynamicsAg-in SolderElectronic PackagingHeat TransferThermal EngineeringLow-temperature Thermocompression BondingMicrostructureCladding (Metalworking)

References

	Year	Citations

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