Concepedia

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan, Aibin Yu, Seung Wook Yoon, John H. Lau, Chengkuo Lee

Journal of Electronic Materials · 2008 · 56 citations · 8 references

DOI

Concepts

References

8

Contact of nominally flat surfaces

J. A. Greenwood, J. B. P. Williamson · Proceedings of the Royal Society of London A Mathematical and Physical Sciences · 1966 · 5.6K citations

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Silver-indium joints produced at low temperature for high temperature devices

Ricky W. Chuang, C.C. Lee · IEEE Transactions on Components and Packaging Technologies · 2002 · 123 citations

, , +11

Room temperature interactions in Ag-metals thin film couples

Vladimir Šimić, Ž. Marinković · Thin Solid Films · 1979 · 81 citations

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The kinetics of formation of intermetallics in Ag/In thin film couples

Rita Roy, Shrabanee Sen · Thin Solid Films · 1991 · 64 citations

, , +12

Solid–liquid interdiffusion bonding between In-coated silver thick films

Jing-Chie Lin, Long Huang, Guh-Yaw Jang et al. · Thin Solid Films · 2002 · 42 citations

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