Riko I Made

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

A. Heryanto, Wahyuaji Narottama Putra, A. Trigg et al. · Journal of Electronic Materials · 2012 · 165 citations

Engineering, Materials Engineering, Materials Science +9

Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

Riko I Made, Chee Lip Gan, Li Ling Yan et al. · Journal of Electronic Materials · 2008 · 56 citations

Natural Sciences, Materials Engineering, Materials Science +15

Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films

Chee Ying Khoo, Hai Liu, Wardhana Aji Sasangka et al. · Journal of Materials Science · 2015 · 43 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation

Govindo J. Syaranamual, Wardhana Aji Sasangka, Riko I Made et al. · Microelectronics Reliability · 2016 · 34 citations

Engineering, Electrical Engineering, Materials Science +16

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

Riko I Made, Chee Lip Gan, Liling Yan et al. · Acta Materialia · 2011 · 32 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14