Wahyuaji Narottama Putra

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

A. Heryanto, Wahyuaji Narottama Putra, A. Trigg et al. · Journal of Electronic Materials · 2012 · 158 citations

Materials Science, Wafer Scale Processing, Engineering +11

Study on Cu Protrusion of Through-Silicon Via

Wahyuaji Narottama Putra, A. Heryanto, A. D. Trigg et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 90 citations

Blind Tsv, Engineering, Mechanical Engineering +17

Effect of tempering temperature and subzero treatment on microstructures, retained austenite, and hardness of AISI D2 tool steel

Myrna Ariati Mochtar, Wahyuaji Narottama Putra, Martin Abram · Materials Research Express · 2023 · 27 citations · Full text

Materials Science, Engineering, High Temperature Materials +11

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

Wahyuaji Narottama Putra, A. Heryanto, A. Trigg et al. · 2012 · 17 citations

Blind Tsv, Engineering, Mechanical Engineering +18

Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics

Fu Long Lau, Riko I Made, Wahyuaji Narottama Putra et al. · Microelectronics Reliability · 2013 · 12 citations

Materials Science, Materials Engineering, Electrical Engineering +8