Concepedia

A. Heryanto

AH

4

Publications

289

Citations

4

H-Index

2011

Active since

Affiliations

Nanyang Technological University(Current)

Agency for Science, Technology and Research

Institute of Microelectronics

Singapore Institute of Manufacturing Technology

A. Heryanto is an author at Nanyang Technological University specializing in electronic packaging, applied physics, and microelectronics.

Top concepts

EngineeringMicrostructureApplied PhysicsMaterial ScienceMicroelectronicsElectronic PackagingIntegrated Circuits3D PrintingAdvanced PackagingElectrical Engineering

Publications per year

2011–2013

4

Publications

4

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

A. Heryanto, Wahyuaji Narottama Putra, A. Trigg et al. · Journal of Electronic Materials · 2012 · 158 citations

Materials Science, Wafer Scale Processing, Engineering +11

Study on Cu Protrusion of Through-Silicon Via

Wahyuaji Narottama Putra, A. Heryanto, A. D. Trigg et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 90 citations

Blind Tsv, Engineering, Mechanical Engineering +17

The effect of stress migration on electromigration in dual damascene copper interconnects

A. Heryanto, K. L. Pey, Yeow Kheng Lim et al. · Journal of Applied Physics · 2011 · 24 citations

Engineering, Large Scale Integration, Integrated Circuits +19

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

Wahyuaji Narottama Putra, A. Heryanto, A. Trigg et al. · 2012 · 17 citations

Blind Tsv, Engineering, Mechanical Engineering +18

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