Yeow Kheng Lim

The effect of stress migration on electromigration in dual damascene copper interconnects

A. Heryanto, K. L. Pey, Yeow Kheng Lim et al. · Journal of Applied Physics · 2011 · 24 citations

Engineering, Large Scale Integration, Integrated Circuits +19

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Xuefen Ong, Soon Wee Ho, Yue Ying Ong et al. · Microelectronics Reliability · 2009 · 20 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +4

Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects

C. W. Chang, Carl V. Thompson, Chee Lip Gan et al. · Applied Physics Letters · 2007 · 19 citations

Engineering, Interconnect (Integrated Circuits), Dual-damascene Copper Interconnects +19

TDDB robustness of highly dense 65NM BEOL vertical natural capacitor with competitive area capacitance for RF and mixed-signal applications

A. Fischer, Yeow Kheng Lim, Ph. Riess et al. · 2008 · 18 citations

Engineering, Defect Tolerance, Interconnect (Integrated Circuits) +16

Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low-$k$ Large-Die Flip Chip Package

J.M.G. Ong, A.A.O. Tay, Xiaowu Zhang et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 18 citations

Thermomechanical Reliability, Engineering, Computed Delamination Stresses +16