Yue Ying Ong

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Engineering, Electrical Engineering +17

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 55 citations

Engineering, Electrical Engineering, Electronic Materials +16

A single-molecular pathway from heterometallic MM′ (M = Baⁱⁱ, Mnⁱⁱ; M′ = Crⁱⁱⁱ) oxalato complexes to intermetallic composite oxides

Kian Eang Neo, Yue Ying Ong, Han Vinh Huynh et al. · Journal of Materials Chemistry · 2006 · 39 citations

Natural Sciences, Chemistry, Materials Science +17

Application of piezoresistive stress sensors in ultra thin device handling and characterization

Xiaowu Zhang, Aditya Kumar, Q.X. Zhang et al. · Sensors and Actuators A Physical · 2009 · 34 citations

Engineering, Materials Engineering, Materials Science +14

A Study To Reduce Chemical Waste Generated in Chemistry Teaching Laboratories

Hui Yi Goh, Wei Wen Clarence Wong, Yue Ying Ong · Journal of Chemical Education · 2019 · 30 citations

Management, Chemistry, Science Education +16