Tango Systems (United States)

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Aluminum nitride on titanium for CMOS compatible piezoelectric transducers

Joseph C. Doll, Bryan C. Petzold, Biju Ninan et al. · Journal of Micromechanics and Microengineering · 2009 · 84 citations · Full text

Triadic Closure Pattern Analysis and Prediction in Social Networks

Hong Huang, Jie Tang, Lu Liu et al. · IEEE Transactions on Knowledge and Data Engineering · 2015 · 82 citations

Engineering, Network Analysis, Social Influence +19

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, John H. Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 52 citations

Engineering, Integrated Circuits, Continuous Push +16

Extracting relations from traditional Chinese medicine literature via heterogeneous entity networks

Huaiyu Wan, Marie-Francine Moens, Walter Luyten et al. · Journal of the American Medical Informatics Association · 2015 · 43 citations · Full text

Engineering, Databases, Mining Methods +27