Statistics
Publications
1
Citations
18
H-Index
1
Active since
2009
Affiliations
Institute of Microelectronics(Current)
J.M.G. Ong is an author at Institute of Microelectronics specializing in microfabrication, engineering, and mechanical engineering.
Publications per year
2009–2009
1
1
Optimization of the Thermomechanical Reliability of a 65 nm Cu/Low-$k$ Large-Die Flip Chip Package
J.M.G. Ong, A.A.O. Tay, Xiaowu Zhang et al. · IEEE Transactions on Components and Packaging Technologies · 2009 · 18 citations
Thermomechanical Reliability, Engineering, Computed Delamination Stresses +16
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