Concepedia

Xuefen Ong

XO

Statistics

Publications

2

Citations

30

H-Index

2

Active since

2009

Affiliations

Institute of Microelectronics(Current)

Xuefen Ong is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsElectronic PackagingApplied PhysicsMicrofabricationAdvanced PackagingIntegrated CircuitsComputer EngineeringElectrical Engineering

Publications per year

2009–2011

2

Publications

2

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages

Xuefen Ong, Soon Wee Ho, Yue Ying Ong et al. · Microelectronics Reliability · 2009 · 20 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +4

Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

Yue Ying Ong, Soon Wee Ho, Vasarla Nagendra Sekhar et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 10 citations

Advanced Packaging, Underfill Selection, Electrical Engineering +14

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