A. Trigg

Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

A. Heryanto, Wahyuaji Narottama Putra, A. Trigg et al. · Journal of Electronic Materials · 2012 · 158 citations

Materials Science, Wafer Scale Processing, Engineering +11

Applications of infrared microscopy to IC and MEMS packaging

A. Trigg · IEEE Transactions on Electronics Packaging Manufacturing · 2003 · 40 citations

Engineering, Microscopy, Micro-optical Component +18

Impact of programming mechanisms on the performance and reliability of nonvolatile memory devices based on Si nanocrystals

C. Y. Ng, T. P. Chen, Miaoxin Yang et al. · IEEE Transactions on Electron Devices · 2006 · 33 citations · Full text

Non-volatile Memory, Engineering, Computer Architecture +16

A novel defect detection technique using active transient thermography for high density package and interconnections

Taichong Chai, B.S. Wongi, Wei Bai et al. · 2004 · 29 citations

Engineering, Integrated Circuits, Visual Inspection +19

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV)

Wahyuaji Narottama Putra, A. Heryanto, A. Trigg et al. · 2012 · 17 citations

Blind Tsv, Engineering, Mechanical Engineering +18