Taichong Chai

Micro-assembled multi-chamber thermal cycler for low-cost reaction chip thermal multiplexing

Quanbo Zou, Yubo Miao, Yu Chen et al. · Sensors and Actuators A Physical · 2002 · 61 citations

3D Ic Architecture, Electrical Engineering, Engineering +11

A novel defect detection technique using active transient thermography for high density package and interconnections

Taichong Chai, B.S. Wongi, Wei Bai et al. · 2004 · 29 citations

Engineering, Integrated Circuits, Visual Inspection +19

Investigation on Die Shift Issues in the 12-in Wafer-Level Compression Molding Process

Lin Bu, Siowling Ho, Sorono Dexter Velez et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 25 citations

Engineering, Mechanical Engineering, Advanced Manufacturing +18

Vacuum packaging development and testing for an uncooled IR bolometer device

C.S. Premachandran, Ser Choong Chong, Taichong Chai et al. · 2004 · 14 citations

Engineering, Ge Window, Developed Vacuum Package +17