Ser Choong Chong

Significantly retarded interfacial reaction between an electroless Ni–W–P metallization and lead-free Sn–3.5Ag solder

Ying Yang, J.N. Balaraju, Ser Choong Chong et al. · Journal of Alloys and Compounds · 2013 · 37 citations

Engineering, Materials Engineering, Materials Science +12

Development of Package-on-Package Using Embedded Wafer-Level Package Approach

Ser Choong Chong, David Ho Soon Wee, Vempati Srinivasa Rao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2013 · 26 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +13

Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications

Sharon Pei Siang Lim, Ser Choong Chong, Vivek Chidambaram · 2021 · 23 citations

Engineering, Materials Engineering, Materials Science +17

6um Pitch High Density Cu-Cu Bonding for 3D IC Stacking

Ling Xie, Sunil Wickramanayaka, Ser Choong Chong et al. · 2016 · 22 citations

Engineering, Materials Engineering, Materials Science +15

Fabrication of patterned and non-patterned metallic nanowire arrays on silicon substrate

Gaurav Sharma, Ser Choong Chong, Liao Ebin et al. · Thin Solid Films · 2006 · 18 citations

Engineering, Materials Engineering, Materials Science +14