Vivek Chidambaram - Concepedia

Author

Vivek Chidambaram

Institute of Microelectronics ORCID

Also Known As

Chidambaram, Vivek, V. Chidambaram, Vivek Chidambaram

Publications

848

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics Agency for Science, Technology and Research Technical University of Denmark Singapore Science Park Nanyang Technological University

About

Vivek Chidambaram is an author at Institute of Microelectronics specializing in engineering, materials science, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	14	726
2	Materials Science	10	11	636
3	Materials Engineering	7	7	552
4	Electrical Engineering	4	4	131
5	Applied Physics	3	3	138

Vivek Chidambaram

Publications

761

Citations

H-Index

Page 1

	Year	Citations
High-temperature lead-free solder alternatives Vivek Chidambaram, Jesper Henri Hattel, John Hald Microelectronic Engineering Materials ScienceMaterials EngineeringEngineeringCorrosionThermal Management	2010	182
Development of Au–Ge based candidate alloys as an alternative to high-lead content solders Vivek Chidambaram, John Hald, Jesper Henri Hattel Journal of Alloys and Compounds Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringAlloy Design	2009	121
Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system Vivek Chidambaram, Jesper Henri Hattel, John Hald Materials & Design (1980-2015) Materials EngineeringMaterials ScienceHigh Temperature MaterialsAu–sn SystemEngineering	2010	96
Dielectric Materials Characterization for Hybrid Bonding Vivek Chidambaram, Prayudi Lianto, Xiangyu Wang, DielectricsEngineeringPecvd Teos Sio2Shear StrengthHybrid Materials	2021	59
Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics Vivek Chidambaram, Ho Beng Yeung, Shan Gao Journal of Electronic Materials Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringHardware Reliability	2012	56
Titanium-Based Getter Solution for Wafer-Level MEMS Vacuum Packaging Vivek Chidambaram, Ling Xie, Bangtao Chen Journal of Electronic Materials Electrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Microfabrication	2012	42
Total losses and dispersion effects management and upgrading fiber reach in ultra-high optical transmission system based on hybrid amplification system G. Ramkumar, Ferlin Deva Shahila, Vanitha Lingaraj, Journal of Optical Communications Free-space Optical NetworkPhotonicsUpgrading Fiber ReachOptical AmplificationEngineering	2024	33
Development of gold based solder candidates for flip chip assembly Vivek Chidambaram, John Hald, Jesper Henri Hattel Microelectronics Reliability Materials ScienceEngineeringAdvanced Packaging (Semiconductors)MicrofabricationChip On Board	2009	31
A corrosion investigation of solder candidates for high-temperature applications Vivek Chidambaram, John Hald, Rajan Ambat, JOM Materials EngineeringMaterials ScienceCorrosion ProtectionEngineeringCorrosion	2009	28
Comprehensive study on Chip to wafer hybrid bonding process for fine pitch high density heterogeneous applications Sharon Pei Siang Lim, Ser Choong Chong, Vivek Chidambaram Pad PitchEngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Comprehensive Study	2021	23

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