Reliability of Au-Ge and Au-Si Eutectic Solder Alloys for High-Temperature Electronics

High-temperature lead-free solder alternatives

Vivek Chidambaram, Jesper Henri Hattel, John Hald · Microelectronic Engineering · 2010 · 185 citations

Natural Sciences, Materials Engineering, Materials Science +8

Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Vivek Chidambaram, John Hald, Jesper Henri Hattel · Journal of Alloys and Compounds · 2009 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +11

Evolution of shear strength and microstructure of die bonding technologies for high temperature applications during thermal aging

Sven Egelkraut, L. Frey, Matthias Knoerr et al. · 2010 · 35 citations

Engineering, Materials Engineering, Materials Science +17

Development of gold based solder candidates for flip chip assembly

Vivek Chidambaram, John Hald, Jesper Henri Hattel · Microelectronics Reliability · 2009 · 31 citations

Engineering, Materials Engineering, Materials Science +11

Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power Applications

Satoshi Tanimoto, Kohei Matsui, Yoshinori Murakami et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2010 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17