Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 347 citations

Natural Sciences, Materials Engineering, Materials Science +10

Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

Rashed Adnan Islam, Bin Wu, M.O. Alam et al. · Journal of Alloys and Compounds · 2005 · 130 citations

Natural Sciences, Materials Engineering, Materials Science +12

Alloy design of Zn–Al–Cu solder for ultra high temperatures

Namhyun Kang, Hye Sung Na, Seong Jun Kim et al. · Journal of Alloys and Compounds · 2007 · 125 citations

Natural Sciences, Materials Engineering, Materials Science +14

Pb-free high temperature solders for power device packaging

Yuri Yamada, Y. Takaku, Yuji Yagi et al. · Microelectronics Reliability · 2006 · 92 citations

Engineering, Electrical Engineering, Materials Engineering +13

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Sun-Kyoung Seo, Sung K. Kang, Da‐Yuan Shih et al. · Microelectronics Reliability · 2009 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +16