Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young‐Sun Kim, Keun‐Soo Kim, Chi-Won Hwang et al. · Journal of Alloys and Compounds · 2003 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +10

Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating

Katsuaki Suganuma, Toshikazu Murata, Hiroji Noguchi et al. · Journal of materials research/Pratt's guide to venture capital sources · 2000 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints

Ikuo Shohji, Takao Nakamura, Fuminari Mori et al. · MATERIALS TRANSACTIONS · 2002 · 83 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Effect of 0.5 wt % Cu addition in Sn–3.5%Ag solder on the dissolution rate of Cu metallization

M.O. Alam, Y.C. Chan, K. N. Tu · Journal of Applied Physics · 2003 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate

Shan-Pu Yu, Hsiu‐Ju Lin, Min‐Hsiung Hon et al. · Journal of Materials Science Materials in Electronics · 2000 · 75 citations

Natural Sciences, Materials Engineering, Materials Science +13