Concepedia
Statistics
Publications
9
Citations
365
H-Index
Active since
2000
Affiliations
National Cheng Kung University(Current)
National Kaohsiung University of Applied Sciences
Industrial Technology Research Institute
National United University
Shan-Pu Yu is an author at National Cheng Kung University specializing in engineering, materials science, and applied physics.
Top concepts
EngineeringMaterial ScienceApplied PhysicsMaterials EngineeringElectronic PackagingAlloysCorrosionMicrostructureMicroelectronicsElectrical Engineering
Publications per year
2000–2010
Formation of intermetallic compounds at eutectic Sn–Zn–Al solder/Cu interface
Shan-Pu Yu, Moo-Chin Wang, Min‐Hsiung Hon · Journal of materials research/Pratt's guide to venture capital sources · 2001 · 81 citations
Materials Engineering, Materials Science, Intermetallic Compounds +2
Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate
Shan-Pu Yu, Hsiu‐Ju Lin, Min‐Hsiung Hon et al. · Journal of Materials Science Materials in Electronics · 2000 · 75 citations
The adhesion strength of A lead-free solder hot-dipped on copper substrate
Shan-Pu Yu, Min‐Hsiung Hon, Moo-Chin Wang · Journal of Electronic Materials · 2000 · 46 citations
Materials Science, Copper Substrate, Engineering +8
The effects of flux on the wetting characteristics of near-eutectic Sn-Zn-In solder on Cu substrate
Shan-Pu Yu, Cheng-Lung Liao, Min‐Hsiung Hon et al. · Journal of Materials Science · 2000 · 38 citations
The evaluation of wafer thinning and singulating processes to enhance chip strength
Shoulung Chen, Tzu-Ying Kuo, Hsu-Tien Hu et al. · 2005 · 31 citations
Materials Science, Wafer Thinning Study, Electrical Engineering +15
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