Hsu-Tien Hu

Statistics

Publications

Citations

107

H-Index

Active since

2003

Affiliations

Industrial Technology Research Institute(Current)

Hsu-Tien Hu is an author at Industrial Technology Research Institute specializing in electrical engineering, electronic packaging, and microelectronics.

Top concepts

EngineeringMicroelectronicsComputer EngineeringElectronic PackagingElectrical Engineering3D PrintingMicrofabricationApplied PhysicsNanoelectronicsReliability

Publications per year

2003–2009

Publications

Enabling 3D-IC foundry technologies for 28 nm node and beyond: through-silicon-via integration with high throughput die-to-wafer stacking

D.Y. Chen, W.C. Chiou, M.F. Chen et al. · 2009 · 47 citations

Engineering, Computer Architecture, Integrated Circuits +21

The evaluation of wafer thinning and singulating processes to enhance chip strength

Shoulung Chen, Tzu-Ying Kuo, Hsu-Tien Hu et al. · 2005 · 31 citations

Materials Science, Wafer Thinning Study, Electrical Engineering +15

Development and characterization of low cost ultrathin 3D interconnect

Wei‐Chung Lo, Yuhua Chen, Jeng-Dar Ko et al. · 2005 · 18 citations

3D Ic Architecture, Electrical Engineering, Economic Criteria +14

The development of enhanced wafer level packaging

Wei‐Chung Lo, Li‐Cheng Shen, Shu‐Ming Chang et al. · 2003 · 11 citations

Level Package, Engineering, Industrial Engineering +17

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