Y. Takaku

Formation of core-type macroscopic morphologies in Cu-Fe base alloys with liquid miscibility gap

C. P. Wang, X. J. Liu, Ryosuke Kainuma et al. · Metallurgical and Materials Transactions A · 2004 · 126 citations

Natural Sciences, Materials Engineering, Materials Science +16

Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device

Yuri Yamada, Y. Takaku, Yuji Yagi et al. · Microelectronics Reliability · 2007 · 111 citations

Engineering, Electrical Engineering, Materials Science +16

Pb-free high temperature solders for power device packaging

Yuri Yamada, Y. Takaku, Yuji Yagi et al. · Microelectronics Reliability · 2006 · 92 citations

Engineering, Electrical Engineering, Materials Engineering +13

Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system

X. J. Liu, Y. Inohana, Y. Takaku et al. · Journal of Electronic Materials · 2002 · 89 citations

Natural Sciences, Chemistry, Materials Science +17

Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders

Y. Takaku, Felicia Lazuardi, Ikuo Ohnuma et al. · Journal of Electronic Materials · 2007 · 81 citations

Natural Sciences, Materials Engineering, Materials Science +14