Y. Takaku

Formation of core-type macroscopic morphologies in Cu-Fe base alloys with liquid miscibility gap

C. P. Wang, X. J. Liu, Ryosuke Kainuma et al. · Metallurgical and Materials Transactions A · 2004 · 124 citations

Materials Engineering, Materials Science, Engineering +9

Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device

Yuri Yamada, Y. Takaku, Yuji Yagi et al. · Microelectronics Reliability · 2007 · 110 citations

Reliability, Electrical Engineering, Reliability Engineering +11

Pb-free high temperature solders for power device packaging

Yuri Yamada, Y. Takaku, Yuji Yagi et al. · Microelectronics Reliability · 2006 · 92 citations

Materials Science, Electrical Engineering, Chip-scale Package +8

Experimental determination and thermodynamic calculation of the phase equilibria and surface tension in the Sn-Ag-In system

X. J. Liu, Y. Inohana, Y. Takaku et al. · Journal of Electronic Materials · 2002 · 88 citations

Materials Science, Engineering, Phase Equilibrium +12

Interfacial Reaction Between Cu Substrates and Zn-Al Base High-Temperature Pb-Free Solders

Y. Takaku, Felicia Lazuardi, Ikuo Ohnuma et al. · Journal of Electronic Materials · 2007 · 81 citations

Materials Science, Materials Engineering, Chemical Engineering +6