Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization

Cyril Buttay, Amandine Masson, Jianfeng Li et al. · 2011 · 67 citations

Engineering, Materials Engineering, Materials Science +13

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, George Scott, Ron Huemoeller et al. · 2017 · 44 citations

Engineering, Computer Engineering, Electrical Engineering +16

Performance and Reliability Characteristics of 1200 V, 100 A, 200°C Half-Bridge SiC MOSFET-JBS Diode Power Modules

James D. Scofield, J. Neil Merrett, James Richmond et al. · 2010 · 43 citations · Full text

Engineering, Electrical Engineering, Materials Engineering +17

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, Ron Huemoeller, Jin-Han Kim et al. · 2015 · 40 citations

Engineering, Computer Engineering, Electrical Engineering +16

Assessment of Au-Ge Die Attachment for an Extended Junction Temperature Range in Power Applications

Satoshi Tanimoto, Kohei Matsui, Yoshinori Murakami et al. · 2010 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17