Cyril Buttay - Concepedia

Author

Cyril Buttay

Also Known As

B. Cyril, Buttay, C., Buttay, C. (Cyril), Buttay, Cyril, C. Buttay, Christian Martin, Cyril BUTTAY, Cyril Buttay, Fabien Dubois, Joubert, Charles

234

Publications

Citations

H-Index

Concepts

All Affiliations

Laboratoire Ampère Université Claude Bernard Lyon 1 Centre National de la Recherche Scientifique Institut National des Sciences Appliquées de Lyon Supergrid Institute

About

Cyril Buttay is an author at Laboratoire Ampère specializing in engineering, electrical engineering, and power electronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	22	45	2.1K
2	Applied Physics	13	13	503
3	Computer Engineering	10	11	647
4	Arts	1	1	18
5	Social Sciences	1	1	36

Cyril Buttay

Publications

2.6K

Citations

H-Index

Page 1

	Year	Citations
State of the art of high temperature power electronics Cyril Buttay, Dominique Planson, Bruno Allard, Materials Science and Engineering B High-power ElectronicsElectrical EngineeringEngineeringPower DevicePower Electronic Systems	2010	398
A Comparative Study of Predictive Current Control Schemes for a Permanent-Magnet Synchronous Machine Drive Florent Morel, Xuefang Lin-Shi, Jean-Marie Rétif, IEEE Transactions on Industrial Electronics Electrical EngineeringElectric MachineEngineeringEnergy Efficient DriveMotor Drive	2009	390
Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles Jianfeng Li, C. Mark Johnson, Cyril Buttay, Journal of Materials Processing Technology	2014	128
Packaged Ga<sub>2</sub>O<sub>3</sub> Schottky Rectifiers With Over 60-A Surge Current Capability Ming Xiao, Boyan Wang, Jingcun Liu, IEEE Transactions on Power Electronics SemiconductorsLow Thermal ConductivityElectrical EngineeringWide-bandgap SemiconductorEngineering	2021	114
Protruding ceramic substrates for high voltage packaging of wide bandgap semiconductors Hugo Reynes, Cyril Buttay, Hervé Morel	2017	88
Thermal Stability of Silicon Carbide Power Diodes Cyril Buttay, Christophe Raynaud, Hervé Morel, IEEE Transactions on Electron Devices Sic DiodeElectrical EngineeringEngineeringPower DeviceNanoelectronics	2012	82
Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization Cyril Buttay, Amandine Masson, Jianfeng Li, Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) EngineeringMechanical EngineeringInterconnect (Integrated Circuits)Die AttachSilver Paste	2011	67
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs Cheng Chen, Denis Labrousse, Stéphane Lefebvre, Microelectronics Reliability Electrical EngineeringReliability EngineeringEngineeringHardware ReliabilityPower Device	2015	66
Migration issues in sintered-silver die attaches operating at high temperature Raphaël Riva, Cyril Buttay, Bruno Allard, Microelectronics Reliability Materials ScienceMaterials EngineeringEngineeringMigration IssuesMechanical Engineering	2013	60
Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging Boyan Wang, Ming Xiao, Jack Knoll, IEEE Electron Device Letters Rf DevicesLow Thermal ResistanceEngineeringThermal ConductivityThermal Resistance	2021	58

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