Concepedia

Curtis Zwenger

CZ

8

Publications

390

Citations

8

H-Index

2008

Active since

Affiliations

Amkor Technology (United States)(Current)

Curtis Zwenger is an author at Amkor Technology (United States) specializing in electronic packaging, computer engineering, and engineering.

Top concepts

EngineeringComputer EngineeringElectronic PackagingMicroelectronicsMicrofabricationElectrical EngineeringAdvanced Packaging3D IntegrationIntegrated CircuitsComputer Architecture

Publications per year

2008–2020

8

Publications

8

Next generation fine pitch Cu Pillar technology &#x2014; Enabling next generation silicon nodes

M. Gerber, C. Beddingfield, Shawn O’Connor et al. · 2011 · 100 citations

Engineering, Silicon On Insulator, Interconnect (Integrated Circuits) +16

Study of interconnection process for fine pitch flip chip

Minjae Lee, Min Seok Yoo, J. Cho et al. · 2009 · 63 citations

Electrical Engineering, Chip-scale Package, Engineering +13

Application of through mold via (TMV) as PoP base package

Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 53 citations

Mold Control, 3D Ic Architecture, Chip-scale Package +13

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, George Scott, Ron Huemoeller et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2017 · 44 citations

Engineering, Device Integration, Mobile Handset +19

Silicon Wafer Integrated Fan-out Technology

Curtis Zwenger, Ron Huemoeller, Jin-Han Kim et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2015 · 40 citations

Engineering, Device Integration, Mobile Handset +19

Rows per page

1–5 of 8