Statistics
Publications
1
Citations
54
H-Index
1
Active since
2008
Affiliations
Amkor Technology (United States)(Current)
Jinseong Kim is an author at Amkor Technology (United States) specializing in package design, memory interface design, and chip packaging.
Publications per year
2008–2008
1
1
Application of through mold via (TMV) as PoP base package
Jinseong Kim, Kiwook Lee, Dongjoo Park et al. · 2008 · 54 citations
1–1 of 1