Concepedia

C. Beddingfield

CB

Statistics

Publications

3

Citations

139

H-Index

3

Active since

1998

Affiliations

Motorola (United States)(Current)

C. Beddingfield is an author at Motorola (United States) specializing in chip packaging, engineering, and semiconductor devices.

Publications per year

1998–2011

3

Publications

3

Next generation fine pitch Cu Pillar technology — Enabling next generation silicon nodes

M. Gerber, C. Beddingfield, Shawn O’Connor et al. · 2011 · 101 citations

, , +17

The effects of flux materials on the moisture sensitivity and reliability of flip-chip-on-board assemblies

C. Beddingfield, Laura M. Higgins · IEEE Transactions on Components Packaging and Manufacturing Technology Part C · 1998 · 22 citations

, , +15

Reliability evaluation of probe-before-bump technology

Qing Tan, C. Beddingfield, Ashok Mistry · 2003 · 16 citations

, , +11

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