IEEE Transactions on Components Packaging and Manufacturing Technology Part C

Underfill flow as viscous flow between parallel plates driven by capillary action

M. K. Schwiebert, Wey H. Leong · 1996 · 165 citations

Engineering, Materials Engineering, Materials Science +17

Electrically conductive adhesives for surface mount solder replacement

Mark Zwoliński, James J. Hickman, Holly-Dee Rubin et al. · 1996 · 143 citations

Natural Sciences, Materials Engineering, Materials Science +15

Frontiers of Electronic Commerce [Book Reviews]

Ravi Kalakota, Andrew B. Whinston · 1996 · 126 citations

Business, Information Systems, Management Information Systems +10

Very fast transmission line pulsing of integrated structures and the charged device model

Horst Gieser, Markus Haunschild · 1998 · 122 citations

Engineering, Electrical Engineering, Physics +17

Surface micromachined solenoid inductors for high frequency applications

Yong-Jun Kim, Mark G. Allen · 1998 · 115 citations

Engineering, Electrical Engineering, Magnetic Materials +16