Min Seok Yoo - Concepedia

Author

Min Seok Yoo

Pohang University of Science and Technology ORCID

Also Known As

M. S. Yoo, M.S. Yoo, Min S. Yoo, Min Seok Yoo, Min Yoo

Publications

844

Citations

H-Index

Concepts

All Affiliations

Pohang University of Science and Technology Amkor Technology (United States)Samsung (South Korea)Konkuk University Institute for Basic Science

About

Min Seok Yoo is an author at Pohang University of Science and Technology specializing in engineering, applied physics, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	12	12	523
2	Applied Physics	9	9	403
3	Chemical Engineering	2	2	71
4	Chemistry	2	2	34
5	Computer Engineering	2	2	163

Min Seok Yoo

Publications

804

Citations

H-Index

Page 1

	Year	Citations
An Ultrastable Ionic Chemiresistor Skin with an Intrinsically Stretchable Polymer Electrolyte Ming Jin, Sangsik Park, Jong‐Seon Kim, Advanced Materials	2018	107
Next generation fine pitch Cu Pillar technology &#x2014; Enabling next generation silicon nodes M. Gerber, C. Beddingfield, Shawn O’Connor, EngineeringSilicon On InsulatorInterconnect (Integrated Circuits)Die ComplexitiesWafer Scale Processing	2011	100
200-mm-wafer-scale integration of polycrystalline molybdenum disulfide transistors Junyoung Kwon, Minsu Seol, Joungeun Yoo, Nature Electronics Electrical EngineeringWafer Scale ProcessingEngineering200-Mm-wafer-scale IntegrationApplied Physics	2024	78
Study of interconnection process for fine pitch flip chip Minjae Lee, Min Seok Yoo, J. Cho, Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Interconnection Technology	2009	63
Direct CVD Growth of a Graphene/MoS<sub>2</sub> Heterostructure with Interfacial Bonding for Two-Dimensional Electronics Eunho Lee, Seung Goo Lee, Wi Hyoung Lee, Chemistry of Materials Molybdenum DisulfideEngineeringGraphene NanomeshesChemical EngineeringNanoelectronics	2020	56
Wafer-scale integration of transition metal dichalcogenide field-effect transistors using adhesion lithography Van Luan Nguyen, Minsu Seol, Junyoung Kwon, Nature Electronics Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringNanoelectronics	2022	51
Alloying effect of Ni, Co, and Sb in SAC solder for improved drop performance of chip scale packages with Cu OSP pad finish Ahmer Syed, Tae‐il Kim, Young Cho, EngineeringSac SolderImproved Drop PerformanceCorrosionSolder Interface	2006	41
Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level Underfill Joonyeob Lee, Tae-Kyung Hwang, Jin‐Young Kim, ReliabilitySoftware Reliability TestingReliability EngineeringEngineeringChip-scale Package	2007	38
Facet‐Mediated Growth of High‐Quality Monolayer Graphene on Arbitrarily Rough Copper Surfaces Hyo Chan Lee, Sae Byeok Jo, Eunho Lee, Advanced Materials	2016	36
Chemical Vapor Deposition of Bernal‐Stacked Graphene on a Cu Surface by Breaking the Carbon Solubility Symmetry in Cu Foils Min Seok Yoo, Hyo Chan Lee, Siyoung Lee, Advanced Materials	2017	31

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