Design of lead-free candidate alloys for high-temperature soldering based on the Au–Sn system

High-temperature lead-free solders: Properties and possibilities

Katsuaki Suganuma, Seongjun Kim, Keun‐Soo Kim · JOM · 2009 · 347 citations

Natural Sciences, Materials Engineering, Materials Science +10

Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

Rashed Adnan Islam, Bin Wu, M.O. Alam et al. · Journal of Alloys and Compounds · 2005 · 130 citations

Natural Sciences, Materials Engineering, Materials Science +12

Development of Au–Ge based candidate alloys as an alternative to high-lead content solders

Vivek Chidambaram, John Hald, Jesper Henri Hattel · Journal of Alloys and Compounds · 2009 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +11

The development of the COST 531 lead-free solders thermodynamic database

Aleš Kroupa, Alan Dinsdale, Andy Watson et al. · JOM · 2007 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +13

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Sun-Kyoung Seo, Sung K. Kang, Da‐Yuan Shih et al. · Microelectronics Reliability · 2009 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +16