Liao Ebin

Development of 3D silicon module with TSV for system in packaging

Navas Khan, Vempati Srinivasa Rao, Samule Lim et al. · 2008 · 78 citations

Engineering, Electrical Engineering, Materials Engineering +17

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Ho Soon Wee, Lee Wen Sheng Vincent et al. · 2009 · 61 citations

Engineering, Electrical Engineering, Materials Science +17

Development of dual-etch via tapering process for through-silicon interconnection

Ranganathan Nagarajan, Krishnamachar Prasad, Liao Ebin et al. · Sensors and Actuators A Physical · 2007 · 42 citations

Engineering, Electrical Engineering, Materials Engineering +12

Development of a Novel Deep Silicon Tapered Via Etch Process for Through-Silicon Interconnection in 3D Integrated Systems

R. Nagarajan, Liao Ebin, Lee Dayong et al. · 2006 · 37 citations

Engineering, Materials Engineering, Materials Science +17

The development of a tapered silicon micro-micromachining process for 3D microsystems packaging

N. Ranganathan, D Y Lee, Liao Ebin et al. · Journal of Micromechanics and Microengineering · 2008 · 33 citations

Engineering, Electrical Engineering, Materials Science +17