Lee Wen Sheng Vincent

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen, Jean‐Michel Hartmann, T. Ernst et al. · Solid-State Electronics · 2004 · 114 citations

Insulator Wafers, Semiconductor Technology, Electrical Engineering +8

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Ho Soon Wee, Lee Wen Sheng Vincent et al. · 2009 · 61 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16

Reduced pressure chemical vapour deposition of SiGe virtual substrates for high mobility devices

Jean‐Michel Hartmann, Y. Bogumilowicz, P. Holliger et al. · Semiconductor Science and Technology · 2003 · 48 citations

Engineering, Vacuum Device, Silicon On Insulator +22

Residual Stress Analysis in Thin Device Wafer Using Piezoresistive Stress Sensor

Aditya Kumar, Xiaowu Zhang, Qing Xin Zhang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 26 citations

Device Wafers, Engineering, Residual Stress Analysis +20

A simple model for boron trapping by He implantation extended defects in Si: the role of boron diffusivity

F. Cayrel, Daniel Alquier, D. Mathiot et al. · Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms · 2003 · 14 citations

Electrical Engineering, Engineering, Physics +13