B. Ghyselen

Wafer bonded four‐junction GaInP/GaAs//GaInAsP/GaInAs concentrator solar cells with 44.7% efficiency

Frank Dimroth, M. Grave, Paul Beutel et al. · Progress in Photovoltaics Research and Applications · 2014 · 569 citations

Wide-bandgap Semiconductor, Iii–v Compound Semiconductors, Engineering +22

Engineering strained silicon on insulator wafers with the Smart CutTM technology

B. Ghyselen, Jean‐Michel Hartmann, T. Ernst et al. · Solid-State Electronics · 2004 · 114 citations

Insulator Wafers, Semiconductor Technology, Electrical Engineering +8

The generic nature of the Smart-Cut® process for thin film transfer

B. Aspar, H. Moriceau, E. Jalaguier et al. · Journal of Electronic Materials · 2001 · 108 citations

Materials Science, Engineering, Smart-cut® Process +8

Ultrathin Ni Silicides With Low Contact Resistance on Strained and Unstrained Silicon

Lars Knoll, Qing‐Tai Zhao, S. Habicht et al. · IEEE Electron Device Letters · 2010 · 64 citations · Full text

Engineering, Optoelectronic Devices, Silicon On Insulator +17

Resonant Cavity Enhanced Ge Photodetectors for 1550 nm Operation on Reflecting Si Substrates

Olufemi Dosunmu, D.D. Cannon, M.K. Emsley et al. · IEEE Journal of Selected Topics in Quantum Electronics · 2004 · 64 citations

Photonic Device, Photonics, Electrical Engineering +14